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Samtec, the world's leading provider of connectivity solutions, has announced the launch of its AcceleRate®New members of HP's high-performance array family, the 800-pin APM6 and APF6 connectors, have a stacking height of only 5mm. This product extends Samtec's portfolio of high-density, high-speed interconnects to provide more compact and powerful connectivity options for high-performance computing (HPC), artificial intelligence (AI), storage and networking devices.
AcceleRate®Known for excellent signal integrity, the HP connector system supports data transfer rates up to 112 Gbps PAM4 and is designed with 0.635mm ultra-fine spacing to meet the high bandwidth and space saving requirements of modern data centers, AI training clusters and high-speed network equipment. This series of products not only with PCIe®6.0, CXL®3.2 and 100GbE protocols are fully compatible, and rigorous channel performance metrics are tested to ensure stability and reliability under extremely high data loads.
The 800-pin model released this time uses an 8-row × 100-pin configuration, which achieves a high pin count while still maintaining an extremely compact size: it covers an area of only 68.62mm × 18.20mm(2.701 inches × 0.717 inches) and a stacking height of 5mm, which is very suitable for application scenarios with limited space and extremely high performance requirements. According to Samtec, a 800-pin version with a stacking height of 10 mm has also been included in the product roadmap and is expected to be officially released in the second quarter of 2025.
In addition to high-density and high-speed transmission capabilities, APM6 and APF6 also have a number of leading product features:
The impedance is controlled to 92.5 Ohm to optimize the signal transmission quality;
Maximum rated current 1.2 A (power supply per 4 pins) to support high power applications;
Operating voltage up to 150 VAC (or 212 VDC);
The open pin field array design provides users with excellent grounding flexibility and routing freedom.
This series of connectors uses Samtec's unique solder column board termination technology (identified by "-0" in the model number), which is specifically developed for high-density high-speed interconnection needs. By forming a strong columnar structure after reflow soldering, this technology significantly improves the mechanical strength and long-term reliability of solder joints, effectively distributes thermal stress and absorbs board deflection, meets IPC Level 3 standards, and passes IPC-9701 temperature cycling tests (-55°C to 125°C) to ensure continuous high signal integrity.
Currently, several APM6 and APF6 configuration models are available for purchase through Samtec authorized distribution channels. As a long-term partner of Samtec, BonChip serves as its authorized distributor, providing sales and ordering services for the full range of Samtec products. With our strong supply chain support, professional technical service team and efficient logistics system, we ensure that customers can enjoy the best cost-effective solutions and the fastest delivery time in the product development and mass production stages.
If you need to know AcceleRate®For information on HP's full range of products, visit Samtec's official website or contact Bangjing's technical team for detailed technical information, sample application and procurement support. If you have specific needs for high-speed board-to-board connections, you are also welcome to obtain original technical services through Bangjing Technology.
