Discover how Samtec's high-speed data communications solutions drive AI/ML, 5G/6G and industrial 4.0 with 224 Gbps PAM4 interconnect technology. As a Samtec distributor, Bonchip Electronics provides high-performance board-to-board connectors, fiber optic systems and backplane solutions to ensure optimal price and fast delivery, helping customers build next-generation data communications infrastructure.
High-speed, high-density, and high-reliability connectivity technologies are redefining the boundaries of data communications.
With the rapid development of artificial intelligence, 5G/6G and industrial 4.0, the global data infrastructure is under unprecedented pressure. Data communications The need for high-speed, high-power-density connectors and world-class cables is becoming increasingly urgent.
As a partner of the Bonchip Electronics, Samtec, with itsIndustry-leading high-performance interconnect solutionsWe are helping engineers meet these challenges.
From servers, switches to phased array radars, Samtec's board-to-board, board-to-cable, optical and high-frequency interconnects provide industry-leading performance for data communication applications, up224 Gbps PAM4。
At present, the field of data communication is in a profound change. AI/ML training requires processing massive amounts of data, 5G/6G networks require extremely high transmission speeds and low latency, and industrial 4.0 makes the number of device connections in industrial environments exponentially increase.
These application scenarios together drive the needHigh-Speed, High-Density, High-Reliability Interconnect Solutionsurgent needs.
As the world's leading manufacturer of PC board-level interconnect devices, Samtec provides a strong response to this challenge through its comprehensive product line and professional services.
Samtec's solutions cover the full range of interconnection needs from chip to system, from board to peripheral, ensuring that signals are transmitted.integrity and reliability。
As an authorized distributor of Samtec, Bonchip Electronics deeply understands these challenges and is committed to providing customers with the most suitable Samtec interconnect solutions to help them stay ahead in the fierce market competition.
In high-speed data communications, signal integrity is a key indicator of connector performance. Samtec's rigorous design and testing processes ensure that its products maintain superior signal integrity during high-speed data transmission.
According to Samtec's official information, there are multiple factors to consider when choosing a connector, includingSystem topology, termination type, signal data rate, and system impedanceWait.
Samtec recommends that for high-speed differential connectors,Ground shield for differential pairsVery beneficial for systems running at 2.5 Gbps and above.
In addition, the stacking height of the connector also affects its performance--Select the shortest connector that can do the jobIt is usually best practice, because shorter connectors mean less reflections and crosstalk, which provides better signal quality.
Samtec product performance indicators in the industry leading position. its COM-HPC™Interconnect Solution Power RatingUp to 300W, the total number of pins reaches 400, the transmission rate of each channelUp to 32Gbps。
Within the broader data communications product line, Samtec offers a compelling range of solutions:
NovaRay®System support per channel128 Gbps PAM4The total data rate is up to 4.096 Tbps.
Samtec not only provides products, but also a full range of professional support. itsSUDDEN SERVICEThe plan gives customers direct access to Samtec's signal integrity experts to optimize their data communication system design.
For customers in the early stages of design, Samtec also offersBurst samples for prototypingrapid customization options and multiple levels of testing options, including harsh environment testing and long-life product testing.
The 5G/6G wireless design incorporates advanced technologies such as massive MIMO, beamforming, large antenna arrays, and full duplex communications. These technologies place extremely high demands on interconnect solutions-requiring high frequency and very low latency interconnect solutions.
Samtec offers a range of innovative interconnect products for 5G/6G systems:
FromCompression Mount Connectorand high-speed interlayers (such as AcceleRate®HD, SEARAY™NOVARAY®)RF Linkage Solution(such as Magnum RF®and Nitrowave™Phase and amplitude stabilized microwave cable assemblies),Samtec's products can reliably provide the necessary performance for 5G and 6G systems.
For special applications, Samtec also offersFlexible waveguideandBULLS EYE®Test Componentsto help customers validate and optimize their designs.
In the area of switches and network equipment, Samtec's high-performance interconnect portfolio support includesEthernet, PCIe®and CXL®Industry standard protocols, data rates up to 224 Gbps PAM4.
Samtec's interconnect solutions cover the full range of needs from the front panel to the IC, to the backplane, and to the PCB:
Flyover®Cable TechnologySignals from the silicon package can be routed directly through long-haul cables, avoiding the BGA area, greatly improving signal integrity.
FireFly™Midplane Optical TransceiverPCIe Supported®/CXL-Over-Optics®Changed the rules of the game for external wiring in AI/ML and decomposed computing topologies.
World-class cable engineering teamOffering products with industry-leading performance and minimum diameter, it greatly expands the signal transmission and interconnection possibilities in switches and networks.
Double data rate memory technology enables better power consumption, density, and transfer speeds in HPC, AI, server, and other data communications applications. but dueSignal density, high speed, compact form factor and PCB stacking requirementsSimulating, prototyping and testing the signal integrity of the latest memory chips and chiplets becomes challenging.
Samtec has developed high-performance interconnectors suchGenerate of DDR/LPDDR IC Feature Card®Product LineandBULLS EYE®Test component seriesto help memory developers improve their chip performance.
Inside the data center, Samtec'sCXL-Over-Optics®SolutionAchieve low-latency links and memory consistency between computing devices, which is essential for modern data center architectures.
NovaRay®is one of Samtec's flagship product series, itCombine extreme density and extreme performance, Achieve a transfer rate of 128 Gbps PAM4 per channel, which reduces space by 40% compared to traditional arrays.
The innovation of this series of products lies in itsIntegral Shielded Differential Pair Design, which achieves extremely low crosstalk (over 40 GHz) and strict impedance control.
NovaRay®The product line includes multiple configurations:
NovaRay®Extreme Density Array: Provides a 92 Ω solution to solve the problem of 85 Ω and 100 Ω applications.
AcceleRate®HP is another Samtec product line to watch. It adopts0.635mm pitch open terminal array, with performance up to 56 Gbps NRZ/112 Gbps PAM4, is a cost-optimized solution.
This series of products provides5 mm and 10 mm stacking heights, providing 800 total terminals and planning to reach more than 1,000 terminals.
Its data rate is similarPCIe®6.0/CXL®3.2 and 100 GbE compatible, with future upgrade potential. At the same time, it also provides Analog Over Array™Ability to support a wider range of application scenarios.
Samtec's optical solutions represent the future direction of data communications interconnect technology. At DesignCon 2024, Samtec demonstrated several high-performance, high-density active fiber connector systems.
among them,CXL Fiber SolutionsPCI Express specification-based physical and electrical interfaces that enable cache coherency between the CPU and connected devices such as accelerators, GPUs, or memory devices.
Samtec的FireFly OpticalProduct lines include:
ECUO Series: Provide x4 and x12 designs, use OM3 multimode fiber, equipped with heat sink, suitable for various cooling methods.
As an authorized distributor of Samtec, Bonchip Electronics not only provide original genuine components, but also provide customers with a series of value-added services:
Bonchip Electronics understand the importance of supply chain stability to customer projects. We provideAdequate inventory managementandCompetitive delivery timeEnsure that customer projects progress on time.
through the BonchipReserve®InventoryAccording to the plan, customers can receive the products within 1 day, greatly shortening the waiting time.
Our technical team is well versed in Samtec product features and application scenarios, and can provide customersProfessional Selection RecommendationsandSignal integrity supportto help customers optimize their data communication system design.
For customers who need a customized solution, Bonchip can provideQuick customization optionsandFull custom product development capabilitiesEnsure that the interconnect solution fully meets the application requirements.
For different customer budgets and needs, Bonchip provideMultiple levels of solutions, from cost optimization to extreme performance, to ensure that customers get the most suitable solution within the budget.
We can also offer our customersAlternative proposalWhen the delivery date or price of a certain product is not ideal, quickly recommend other options with equivalent performance to ensure the smooth progress of customer projects.
In the face of the rapid development of the field of data communication, Samtec through itsInnovative interconnect solutionsandProfessional technical supportIt provides engineers with powerful tools to address these challenges.
Up to 128 Gbps PAM4 NovaRay per channel®systems, to support CXL-over-Optics FireFly™optical solutions, Samcec's product portfolio enables customers to buildHigher performance, higher density and higher energy efficiencyThe data communication system.
As a Samtec distributor, Bonchip Electronics is ready to provide you with the best product supply solutions and the best prices.Contact our technical team to find out how to incorporate Samtec's high-speed interconnect solutions into your next data communications design.
Si-Fly®LP is Samtec's thinnest Flyover®A cable solution that can be located near the IC package, under the heat sink or other cooling hardware, with performance up to 112 Gbps PAM4.
Up to 16 pairs, 4.35mm extremely light and thin appearance
Near-chip (ASIC adjacent) cable system
Ideal for high-density applications with z-axis height constraints
112 Gbps PAM4 performance per channel
PCIe®6.0/CXL®3.2 ability
Avoid the BGA and route the signal directly from the silicon package through the long-haul cable
XCede by Samtec®HD high-density backplane systems are ideal for density-critical applications in a small form factor, with a modular design that enables flexibility and customizable solutions.
Small form factor saves space
Modular design increases flexibility in applications
High-density backplane system-up to 84 differential pairs per linear inch
1.80mm column spacing
3, 4 and 6 pairs of design
4, 6 or 8 columns
12-48 pairs
Terminal sliding range up to 3.00mm on signal terminals
Multiple signal/ground terminal configuration options available
Provide integrated power supply, guidance, locking and side walls
85 Ω and 100 Ω options
Three levels of power-up sequence for hot-swap
Cost-effective design for low-speed applications
Power modules (HPTT/HPTS) are available as a stand-alone power solution with a maximum current of 10 amps per blade
NovaRay®Combine extreme density with extreme performance to achieve 128 Gbps PAM 4 per channel, which reduces space by 40% compared to traditional arrays.
128 Gbps PAM4 per channel
PCIe®7.0 Compatible
4.0 Tbps total data rate -9 IEEE 400G lanes
Innovative overall shielded differential pair design for extremely low crosstalk (over 40 GHz) and tight impedance control
Two terminals ensure a more reliable connection
The 92 Ω solution solves the problem for both 85 Ω and 100 Ω applications
Analog Over Array™能力
NovaRay®I/O usage Flyover®Cable technology that can route up to 4,096 Gbps PAM4 total data from the IC package to components such as panels, using a rugged 38999 enclosure.
Highest Total Data Rate in the Market -4,096 Gbps PAM4
128 Gbps PAM4 per channel
PCIe®7.0 Compatible
16 & 32 differential pair configuration; accommodates PCIe®x4 or x8 plus sideband
Adopt Flyover®Cable-to-cable bulkhead or threaded 38999 panel connection for cable technology
Durable 38999 case resistant to salt spray for 48 hours with IP67 sealing option (NVA3E/NVA3P)
External cable: 28 or 34 AWG ultra-low skew dual core
Internal Cable: 34 AWG Ultra Low Skew Twin or Thinax™
Single-ended ThinSE also available™Coaxial Cable Options
External full EMI protection
Adjacent Flyover for your ASIC®Interconnector provides multi-terminal 2High Speed ConnectorSelect
NovaRay®The miniature, durable backplane system combines ultra-high density with offset packaging for optimal signal integrity performance at 128 Gbps PAM4.
Ultra-high density with up to 128 differential pairs in a single connector
128Gbps PAM4 performance per channel
PCIe®7.0 Compatible
Support blind insertion application
Surface mount, higher density, better performance
Biased package for optimal signal integrity
Design Adoption Flyover®Cable Assembly
AcceleRate®The HP 0.635mm pitch array offers the ultimate performance of 112 Gbps PAM4 with flexible open terminal design.
View full range of AcceleRate®Products.
0.635mm pitch open terminal array
Performance up to 56 Gbps NRZ/112 Gbps PAM4
Cost-optimized solutions
5 mm thinness, 10 mm stack height
800 total terminals provided; process plan reaches over 1,000 terminals
Data Rate and PCIe®6.0/CXL®3.2 and 100 GbE compatible
Analog Over Array™能力
View full range of AcceleRate®Products
AcceleRate®HP Cable Assemblies are the industry's highest density 112 Gbps PAM4-class solutions for near-chip cable-to-board applications or co-packaged (direct-to-chip package) solutions.
View full range of AcceleRate®Products.
Industry's highest density 112 Gbps PAM4 near-chip cable-to-board system or co-packaged (direct-to-chip package) solution
The near-chip solution overcomes the challenge of launching a large number of transmission lines outside the board of the near chip (ARP6, APF6-L/APF6-T/APF6-S/APF6-RA-S)
Co-packaged (direct-to-chip package) solution provides the lowest loss signal transmission from the package to the front panel or backplane, while providing the highest density (ART6, ATF6)
Data Rate and PCIe®6.0/CXL®3.2 and 100 GbE compatible
32 to 96 differential pairs
Row 4, 6 or 8
34 AWG Eye Speed Thinax™Ultra Low Skew Twin Cable, or 34 AWG Eye Speed ThinSE™Fine Miniature Coaxial Cable
Eye Speed Thinax™Cable technology can reduce overall weight and maximize airflow, making it easy to pass through the system; Ultra-low deflection: maximum 3.5 ps/meter
Durable squeeze lock for quick disconnection or locking of welded tabs for maximum density (requires removal tool)
Ideal for AI, high performance computing (HPC) and data center applications
View full range of AcceleRate®Products
Samtec's FireFly™ Micro Flyover System™ embedded and rugged mid-board optical transceivers take data connection "off board" for up to 28 Gbps per lane with a path to 112 Gbps PAM4 via optical cable at greater distances, or copper for cost optimization.
High-speed performance up to 28 Gbps per channel
x4 and x12 design
Interchangeability of copper cable and optical fiber
Multiple integrated heatsink and termination 2 solutions
Miniature durable two-piece connector
Wide temperature fiber PCIe®Solution
These direct-attached Flyover®SFP/QSFP/OSFP Cable Assemblies Route Critical High-Speed Signals Over Ultra-Low-Skew Twin Cables EYE SPEED®to improve and extend signal integrity.
4 or 8 channel system
Eye Speed®100 ohm twin core cable
PCIe®6.0/CXL®3.2 ability
Crimp the tail end for low-speed signal/power supply to the PCB
Reduces cost and power consumption without re-timers
Improves heat dissipation by allowing the IC to be placed in a preferred location
Front-to-front butt joint for highest density (FQSFP-DD series)
Multiple terminal 2 options available
Compatible with all MSA QSFP pluggable interfaces
These 0.635mm pitch high-density high-speed signal/power arrays can achieve 64 Gbps PAM4 speeds, and have rotating power blades to improve performance and simplify the shunt area (BOR).
View full range of AcceleRate®Products.
Best-in-class power and signal density
The power plug can be rotated by 90 °, so that it can equally obtain heat release to achieve uniform cooling, increase current capacity and reduce crowding
Supports 64 Gbps PAM4(32 Gbps NRZ) applications
PCIe®6.0/CXL®3.2 ability
Open-pin-field design for maximum grounding and routing flexibility
High-density multi-row design
Thin and light 5 mm and 10 mm stacking height; up to 16 mm on the road map
A total of 4 or 8 power supply blades; up to 10 models are under development
A total of 60 or 240 signal positions; more position models are under development
0.635mm signal spacing
Optional locating pin
Standard solder tab for secure connection to circuit board
thimble guide post for blind insertion
View full range of AcceleRate®Products
A product family that supports board-to-board, cable-to-board, and cable-to-cable applications
Current up to 18 A per blade
40% less space than traditional power systems
2-10 power blades, 2.00mm pitch
5 mm to 16mm, 18 mm and 20 mm stack heights
The breakaway cable assembly has a durable latch that simplifies board layout and provides power directly to the active components in the system
All Samtec series are subject to design qualification testing
Rigorous testing to assess terminal resistance under simulated storage/field conditions
Proactively test beyond typical standards for extreme applications
