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Samtec, which has been working in the field of data communication for more than 30 years, has always led the wave of innovation in storage device connection technology. As BONCHIP strategic partners, the two companies work together to provide global customers with the rapid delivery of a full range of interconnection solutions and professional technical support.
From the magnetic core memory of the Apollo 11 moon landing computer to the LPDDR5 of modern smartphones, the storage medium has undergone a leap forward. It is worth noting that the AGC computer used by NASA in 1969 had only 72KB of memory capacity, and now a single mobile processor can integrate up to 16GB of L3 cache. Behind this exponential growth, the bandwidth evolution of connected devices is also remarkable-the speed of modern memory interfaces has exceeded 6400MT/s, 200 times that of the early SDRAM standard.
Although the traditional tightly coupled architecture can achieve nanosecond delay, it has the problem of resource island. Test data from a large cloud service provider shows that the peak-to-valley difference in GPU memory utilization in its data center is 63%, resulting in a waste of millions of dollars in resources every year. To this end, the industry proposed CXL(Compute Express Link) open interconnect standard, through memory pooling technology to increase the average utilization rate to more than 85%.
Samtec's CXL-over-Optics solutions based on electro-optical fusion excel in this area: its FireFly®Micro Flyover system can realize 112Gbps PAM4 signal transmission, and the delay is 40% lower than that of traditional copper cable. Cooperate with Bulls Eye®High-speed test sockets allow engineers to accurately verify the signal integrity of DDR5-7200 memory modules.
Elastic Scaling: Generate®High-speed backplane connector supports 1.6mm pitch design, meets OCP NIC 3.0 specification requirements, and provides hardware foundation for scalable memory architecture
Signal fidelity: Bison series mezzanine connectors use patented multi-point contact technology, which can maintain an insertion loss better than-35dB at 56Gbps
Thermal optimization: PowerTiger®The power connector supports 60A current carrying capacity per contact, and the temperature rise can be controlled within 15 ℃ with the heat pipe cooling scheme.
As a Samtec distributor, BONCHIP not only maintain a standing inventory of 3000 models, but also set up a professional FAE team to provide full-cycle services from selection guidance to signal integrity analysis. For urgent needs, customers in Asia can enjoy 48-hour speed delivery service.
With the CXL 3.0 specification increasing interconnect bandwidth to 64GT/s,Samtec has begun to develop silicon photonics-based interconnect solutions. Its Co-Packaged Optics prototype product successfully achieved a bandwidth density of 1.6Tbps/mm², laying the foundation for the next generation of integrated storage and computing architecture.
Contact BONCHIP Technical Support for the latest High-Speed Memory Interconnect Design White Paper or for a customized solution. We provide 7 × 24-hour multilingual services to help customers quickly achieve product upgrades.
