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GCT's board-to-board connectors provide a reliable and space-saving interconnection solution for printed circuit board connections in compact electronic assemblies. The range is available in a variety of pitch sizes, stacking heights, and mounting orientations, making it ideal for design applications where mechanical stability and signal integrity are critical. GCT offers both surface mount and through-hole mount options, enabling customers to specify pin lengths and a variety of profile heights to meet the layout needs of different applications such as consumer electronics, industrial equipment and medical equipment.
Contact Material: Copper Alloy
Standard Insulator Material: Polyester LCP, UL94 V-0
(A) Finish: Gold Flash All Over - Under Plate: Nickel 30-50µ”
(B) Finish: Selective gold flash contact area/tin on tail - Under Plate: Nickel 50-100µ”
(C) Finish: Tin All Over – 80µ” minimum – Under Plate: Nickel 30-50µ”
(G&I) Finish: Gold 10µ” (G) or 30µ” (I) on contact area. Tin 100µ” minimum on tail - Under Plate: Nickel 50-100µ”
Current Rating: 2 AMP
Contact Resistance: 20mΩ Max.
Insulation resistance: 1000 MΩ MIN.
Dielectric withstanding voltage: AC 500 V
Operating Temperature: -55°C to 105°C
LCP Suitable For: IR Reflow, Wave, Manual solder
