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GCT's Micro SD connectors offer reliable data storage in a compact design and are ideal for consumer devices, industrial systems and IoT applications where space is limited and performance is critical. Available in push-push, push-pull and hinged types, these connectors provide flexible card access and robust mechanical performance to support frequent use in embedded and field-serviceable designs.
Contact Material: Copper Alloy
Standard Insulator Material: LCP, Black, UL 94V-0
Contact Terminal: Copper Alloy
Metallic Shell: Stainless steel
Contact Terminal plating
Underplating: 40μ "Min. Nickel all over
Contact Plating: Gold flash
Solder Area: 80µ" Min. Matte Tin
Metallic Shell plating
Underplating: 30μ "Min. Nickel all over
Solder Area: Gold flash
Voltage Rating: 30V DC
Current Rating: 0.5A
Contact Resistance: 100mΩ Maxs
Insulation resistance: 1000MΩ Min
Dielectric withstanding voltage: 500VAC, 1 Min.
Durability: 5,000 Cycles
Operating Temperature: -40°C to 85°C
Solder Temperature: Peak temp 260°C ( 0/-5°C) Maximum (5 seconds)
