Heat Shrinkable Package Seat, Solder Tail, 16 Pole, 0.25 μm Gold/0.25 μm Gold

1.778mm narrow spacing to achieve high density PCB wiring; Gull-shaped pins adapt to SMT mounting process
Heat shrinkable package contacts, accurate positioning, reed stability
Double-sided 0.25μm gold plating, anti-oxidation, to ensure stable electrical performance
Working temperature range:-55 ℃ ~ 125 ℃