Leading Distributor of Electronic Components-Bangjing Technology | BonChip-SEAMP 0.050-inch SEARAY™High-speed, high-density press-fit open-pin grid array terminal

SEAMP for SEARAY™Series of 0.050-inch (1.27 mm) pitch high-speed, high-density open-pin‑grid‑array crimp terminals, featuring press-fit tails and Edge Rate.®Durable contact design, with a single-contact rating of 1.9A and a dielectric strength of 255 VAC/361 VDC; available in stack heights of 7 mm, 8 mm, 8.5 mm, and 9.5 mm, featuring reduced insertion/extraction forces, making it ideal for high‑speed, high‑density inter‑board connections that require no soldering and enable rapid assembly.