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Leading Distributor of Electronic Components-Bangjing Technology | BonChip-SEAFP 0.050-inch SEARAY™High-speed crimp-type open-pin grid array socket

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SEAFP 0.050 inch SEARAY™High-speed crimp-type open-pin grid array socket

SEAFP is SEARAY™Series of 0.050-inch (1.27 mm) pitch high-speed open-pin‑grid array crimp sockets, featuring a high‑density pin‑grid arrangement and Edge Rate technology.®High‑intensity contact structure, with a single‑contact rated current of 1.9A and a dielectric strength of 255 VAC/361 VDC; crimp‑type, solder‑free assembly design; stack heights ranging from 7 to 16 mm; low insertion/extraction forces; suitable for high‑speed, high‑density interconnection between boards in rapid assembly applications.

SEAFP 0.050 英寸 SEARAY™ 高速压接式开放针栅阵列插座
SEAFP 0.050 英寸 SEARAY™ 高速压接式开放针栅阵列插座

Details

SEAFP 0.050 inch SEARAY™High-speed crimp-type open-pin grid array socket


Product Features:

  1. high density open pin grid array structure

  2. Press-fit pin (crimp tail)

  3. Rugged Edge Rate®contact shrapnel

  4. Single contact maximum rated current: 1.9A

  5. Maximum rated voltage: AC 255V/DC 361V

  6. Stack height optional range: 7mm ~ 16mm

  7. Lower insertion resistance