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The modern digital environment isArtificial intelligence, high-performance computing and 5G/6G networksDriven by explosive growth, demand for transmission speeds has reached levels unimaginable just a few years ago. This technological revolution has given rise to a new class of high-speed interconnect solutions-the inheritors of traditional backplane systems-that data centers and AI clusters rely on for point-to-point transmission of massive amounts of data.
When connector manufacturers discuss support112 Gbps PAM4even224 Gbps PAM4This level of performance not only reflects the needs of hyperscale infrastructure, but also indicates that these capabilities will inevitablypenetratedaily equipment. Just as innovative technologies in Formula One racing will impact family cars, breakthroughs in extreme performance connectors are shaping intercom systems for next-generation applications, such as the evolving "data center-on-wheels" architectures found in modern automotive systems.
Although the printed circuit board has historically been the backbone of electronic equipment, it has become a major bottleneck in achieving future speeds. At 56 Gbps PAM4 and higher data rates, traditional PCB traces face severe challenges: extreme attenuation, excessive crosstalk, and signal loss. Even relatively short PCB traces typically require expensive and power-hungry retimers to maintain signal integrity.
Flyover of Samtec®Cable TechnologyIt is the architectural solution that addresses this fundamental limitation. Its core concept is simple and transformative: routing critical high-speed signals directly from the chip or near the chip through ultra-low-loss, ultra-low-offset dual-core cables,Bypass the lossy PCB. By shortening or eliminating PCB trace paths, Flyover®The system reduces signal loss, ensures a clearer eye diagram, extends signal transmission distance, and provides a cost-effective, high-performance, and heat-dissipating solution for expansion to 224 Gbps and beyond. Samtec is also exploring future substrate technologies such as itsGlass Core TechnologyThe concept is shown to overcome inherent material limitations.
Flyover®Technology by Samtec PowerfulEye Speed®Cable AssembliesSupported by a portfolio of components optimized for density and extreme performance for different applications and speed requirements:
Eye Speed® Twinax
Speed capacity: highest112 Gbps PAM4
Key technical features: ultra-low offset (maximum 3.5 ps/m), co-extruded structure to achieve tight coupling
Application Advantage: Ideal balance of performance and cost in 112 Gbps systems; 92, 85 or 100 Ω impedance options available
Eye Speed Thinax™
Speed capacity: highest112 Gbps PAM4
Key technical characteristics: cross-sectional area than standard dual-core cableSmall 40%
Application benefits: Significant overall weight reduction, maximum airflow in dense systems, easier wiring
Eye Speed® Hyper Low Skew Twinax
Speed capacity: highest224 Gbps PAM4
Key technical features:Industry-leading ultra-low offset 1.75 ps/meter; Insertion loss 14.3 dB
Application advantage: Critical for next-generation 224 Gbps PAM4 systems, providing maximum bandwidth and transmission distance
Eye Speed ThinSE™
Speed Capability: Up to 5 Gbps NRZ
Key technical features: 0.024 inch outer diameter miniature coaxial cable
Application advantage: Supports single-ended and mixed signal transmission in applications with extreme space constraints
Samtec offers comprehensive Flyover®Solutions that integrate these high-performance cables into every part of the system architecture:
Near-Chip and Co-Package Solutions
Si-Fly®HD & Si-Fly®LP: Si-Fly®HD systems are the highest density on the market224 Gbps PAM4Solution, which can be implemented on small substratesElectrically pluggable co-packaged copper and optical modulesSolution
AccelleRate®HP: Industry's highest density112 Gbps PAM4Near-chip cable-to-board solution with Eye Speed Thinax™Achieve maximum airflow and density
AccelleRate®Mini: By Eye Speed Thinax™The cable is available in a very small form factor112 Gbps PAM4Performance
I/O and Panel Mount Systems
Flyover® SFP/QSFP/OSFP系统Direct connect solution to route critical signals through low-loss dual-core cables instead of lossy PCB traces near the shielded cage
NovaRay®I/O Panel Mount: Achieve the highest total data rate in the market, from the IC package to the panel and the highest distance routing4,096 Gbps PAM4
ExaMAX® I/OFully shielded I/O cable system, available in cable-to-panel configuration64 Gbps PAM4Performance
High-density arrays and backplanes
NovaRay® 128 Gbps PAM4阵列Combined with extreme density and performance, per-channel support128 Gbps PAM4
ExaMAX®Backplane System: Provides high density and modular flexibility through Flyover®Cable Support112 Gbps PAM4
Optical Solutions
FireFly™Optical Transceiver: Micro Flyover System by Samtec™Embedded transceivers provide interchangeability between copper and optical solutions
Halo®Next Generation Midplane Optical Transceiver: as needed56/112 Gbps PAM4Performance designed for embedded applications
BONCHIPAsReliable distributor of Samtec products, deeply understand the stringent requirements of ultra-large-scale computing for high-speed interconnection technology. We are committed to providing our customersState-of-the-art technology products and best supply chain services：
Full line product supply
Full Samtec Flyover®Cable Assemblies and High-Speed Array Solutions
Eye Speed®Full range of cable products and technical support
Original genuine guarantee, provide complete technical documentation and certification information
Customized solution development support
Professional Technical Support
OurHigh-Speed Connected Expert TeamExtensive experience in AI and HPC applications, offering:
System architecture design consulting and optimization recommendations
Signal integrity analysis and simulation support
Thermal Management Solution Design Guidance
System-level test and verification services
Supply Chain Excellence
With efficient inventory management and a global logistics network, we ensure that customer orders areQuick response, provideThe most competitive delivery timeTo provide reliable guarantee for customers' R & D and mass production plans.
Cost optimization value
Through technical solution optimization and supply chain integration, we help customers under the premise of ensuring performanceOptimize overall system costIncrease the competitiveness of the product market.
Higher transmission rate evolution
As AI and HPC applications continue to evolve, the demand for data transfer rates will continue to rise. Future systems will evolve to 448 Gbps and higher rates, placing higher demands on connector technology and materials science.
More advanced packaging technology
Co-packaged optical and copper solutions will continue to evolve, enabling higher port density and better performance in smaller sizes.
intelligent management system
Intelligent connectivity solutions that integrate health monitoring and predictive maintenance capabilities will become standard, improving system reliability and maintainability.
green energy saving design
Energy efficiency optimization and thermal management will be key considerations, driving the development of connector solutions with lower power consumption and better thermal performance.
In the digital age driven by AI, HPC and 5G/6G networks, ultra-high-speed interconnection technology has become a key factor in driving technological progress. Samtec through its innovative Flyover®Technology and Eye Speed®The cable portfolio provides a reliable solution for hyperscale computing.
BONCHIPAsA reliable partner for Samtec products, has always been committed to providing customersThe most advanced product technology and the best quality supply chain services. OurProfessional TeamWith deep technical background and rich industry experience, you can provide comprehensive support from conceptual design to mass production for your hyperscale computing projects.
Choosing BONCHIP is the perfect combination of professional technical support, reliable product quality and efficient supply chain services!
