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2025-11-04 Leading global connector manufacturerSamtecrecently issued a Product Change Notice (PCN 803), announced as its popularBCS-1XXandSSM-1XXSeriesHigh Speed ConnectorProduct implementation of an important manufacturing process optimization. The change will be implemented gradually from February 2, 2026, and aims to further improve the manufacturing stability and material reliability of the product by adding a micro-cavity in the front area of the top of the product body.
As a Samtec authorized professional distributor,BonChip ElectronicsTake the lead in bringing you the in-depth interpretation of this technology update. We are committed to providing our customers with up-to-date product information, easy ordering across the product line, competitive pricing and fast delivery to ensure seamless adoption of these continuously optimized, high-performance components.
This change reflects Samtec's commitment to continuous improvement. The specific changes are: In the designated area of the BCS-1XX and SSM-1XX series connector body,Add a micro-void with dimensions of approximately 0.76 x 0.64 x 0.46mm。
Change Purpose: This design is primarily designed to optimize resin reflow during the injection molding process, thereby reducing internal stresses and ensuring unparalleled dimensional stability and consistency in mass production.
Impact Assessment: Samtec clearly emphasizes that this change is purely a process and structural optimization and will not have any impact on the electrical performance, mechanical fit or function of the product. The only difference is a change in appearance that is visible to the naked eye and easy to identify.
Increased reliability: For demanding application scenarios, greater manufacturing consistency translates directly into longer end product life and higher field reliability.
BCS-1XX series (high-speed backplane connector): This series is specially designed for next-generation network and communication equipment that supports high-speed data transmission of 25 Gbps, and is widely used in key equipment such as data center servers, switches, routers, and storage systems. Its excellent signal integrity and high density are the cornerstones of supporting 5G, cloud computing and artificial intelligence infrastructure.
SSM-1XX series (Board-to-board connector): This series provides robust shielded board-to-board interconnect solutions for telecommunications infrastructure, industrial automation, test and measurement equipment, and military/aerospace applications that require excellent shock and vibration resistance. Its robust design ensures a stable connection in harsh environments.
Full line of product sales: inventory covers the entire Samtec line of products, including the latest BCS-1XX and SSM-1XX series
Best service: Our technical sales team can provide you with product selection, data interpretation and application support.
The most convenient delivery: With an efficient global supply chain system, we are committed to providing you with the most competitive delivery cycle to help your project move forward quickly.
If you have any questions about this product change or related products, please feel free to contact the BonChip team through the contact information below. We'll ensure a smooth transition to new versions of your products and help you stay ahead of the curve with your designs.
-Business sales please E-MAIL:Sales@BonChip.com
-After-sales service please E-MAIL:Service@BonChip.com
-Technical Support Please E-MAIL:Info@bonchip.com
