(A) Finish: Gold Flash All Over - Under Plate: Nickel 30-50µ” (B) Finish: Selective gold flash contact area/tin on tail - Under Plate: Nickel 50-100µ” (C) Finish: Tin All Over – 80µ” minimum – Under Plate: Nickel 30-50µ” (G&I) Finish: Gold 10µ” (G) or 30µ” (I) on contact area. Tin 100µ” minimum on tail - Under Plate: Nickel 50-100µ”
Electrical
Current Rating: 1 AMP Contact Resistance: 20mΩ Max. Insulation resistance: 1000 MΩ MIN. Dielectric withstanding voltage: AC 300 V
Environmental and Processing
Operating Temperature: -40°C to +105°C LCP Suitable For: IR Reflow, Wave, Manual solder High Temperature Nylon Suitable For: IR Reflow, Wave, Manual solder
